Browse Prior Art Database

Wire Plating

IP.com Disclosure Number: IPCOM000053676D
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Moore, RJ Sterbentz, JG [+details]

Abstract

Dry plating of wire is accomplished by cathode sputtering using a conical target. In the figure, a vacuum chamber 1 houses supply and take-up reels 2 and 3, for wire 4, that are mounted for rotation on supports 5 serving also as anodes. The wire is threaded along the axis of conical cathode 6 composed of a material having a low sputter rate. Strips 7 that are to serve as the source material are mounted in openings 8 in the cathode walls. Inlet port 9 and exhaust port 10 handle sputtering gas, such as argon. Take-up reel 3 may be driven from outside the vacuum chamber by a rotating magnetic coupling. The glow discharge occurs at a point intermediate the ends of the cathode depending upon the parameters of pressure and electrical field.