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Process for Treatment of Electrolessly Plated Layer Disclosure Number: IPCOM000053702D
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12

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Fury, MA Van Steenburgh, J [+details]


In the semiconductor packaging technology, it is frequently advantageous to form metallurgy pads on a substrate by electroless plating. This technique does not require that electrical contact be made to all of the pads as is necessary in electroplating techniques. When depositing an electroless nickel-boron layer on such pads, small blisters may form during the subsequent heating step for diffusion bonding the nickel to the underlying layer, for example, a molybdenum layer. These blisters in the plated layer can present serious yield problems.