Browse Prior Art Database

Process for Treatment of Electrolessly Plated Layer

IP.com Disclosure Number: IPCOM000053702D
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Fury, MA Van Steenburgh, J [+details]

Abstract

In the semiconductor packaging technology, it is frequently advantageous to form metallurgy pads on a substrate by electroless plating. This technique does not require that electrical contact be made to all of the pads as is necessary in electroplating techniques. When depositing an electroless nickel-boron layer on such pads, small blisters may form during the subsequent heating step for diffusion bonding the nickel to the underlying layer, for example, a molybdenum layer. These blisters in the plated layer can present serious yield problems.