Process for Treatment of Electrolessly Plated Layer
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12
In the semiconductor packaging technology, it is frequently advantageous to form metallurgy pads on a substrate by electroless plating. This technique does not require that electrical contact be made to all of the pads as is necessary in electroplating techniques. When depositing an electroless nickel-boron layer on such pads, small blisters may form during the subsequent heating step for diffusion bonding the nickel to the underlying layer, for example, a molybdenum layer. These blisters in the plated layer can present serious yield problems.