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Placement of Alternative IC Chips in the same Substrate Area Disclosure Number: IPCOM000053747D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

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Related People

Johnson, CL [+details]


Chip footprints for different integrated-circuit (IC) chips are placed one within the other in a ceramic substrate area, and corresponding chip pads are wired in parallel. Either chip may be bonded to the substrate to facilitate variations in memory capacity or other capabilities without wasting module area or building different modules.