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Lapping Guide Probe

IP.com Disclosure Number: IPCOM000053785D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Koloseus, JC Lakey, BR [+details]

Abstract

Spring-loaded contacts under a cantilever arrangement provide a pressure for positive contact with lapping guide pads on a thin film head. The L-shaped contacts are fastened to the top of the probe and extend through guide points to beneath the probe body. Placing the probe against the head causes the contacts to flex and thereby provide a positive connection to the connection pads in the head.