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Top Surface Divider for Modules Disclosure Number: IPCOM000053844D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

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Related People

Greer, SE Neuman, EW [+details]


In certain modules, different types of chips may be mounted on the same substrate, e.g., microprocessor, logic, and memory chips. Each of these may require different types of mounting treatments, for example, different types of overcoats and, in some cases, alpha particle barriers or thermal enhancements.