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Reworkable Cap Disclosure Number: IPCOM000053845D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

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Related People

Phelps, DW Ward, WC [+details]


It is frequently necessary to remove the cap from a module, comprised of a semiconductor chip mounted on a substrate, to rework the module. In such case it is desirable to have a seal between the cap and substrate which effectively seals hermetically and which also allows for facile removal and replacement of the cap.