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Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
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An improved technique for interconnecting the elements of a stacked module is described.
English (United States)
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100% of the total text.
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Stacking Method Employing Metallized Tape
An improved technique for interconnecting the elements of a stacked module
In the figure, a pair of ceramic substrates 10 and 12, having various chips 14
and 16 mounted thereon, are arranged in a stacked configuration. Extended pin
heads run from the surface metallization 18 on one substrate 10 to the surface
metallization 20 on the other substrate 12 to provide electrical interconnection in
a conventional manner.
The two substrates 10, 12 are wrapped with a flexible tape 22 having an
adhesive 24 on the inner surface. The tape 22 may be an adhesive-backed tape
preferably employing a thermoset tacky adhesive which will provide a good
hermetic seal. Also, an epoxy backseal 26 may be applied to the outside surface
of the module 10 if metallization is present and requires protection.
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