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Low Temperature Lift Off Process

IP.com Disclosure Number: IPCOM000053851D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Emmanuel, SD [+details]

Abstract

A process is provided for depositing a material, such as a metal, at low temperatures on lift-off structures with good adhesion and improved electrical qualities while self-aligning barrier or intermediate layers. The process is, more specifically, a hybrid sputtered-evaporated metallurgy process for depositing a wide variety of metallurgy with low temperature lift-off structures.