Low Temperature Lift Off Process
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12
A process is provided for depositing a material, such as a metal, at low temperatures on lift-off structures with good adhesion and improved electrical qualities while self-aligning barrier or intermediate layers. The process is, more specifically, a hybrid sputtered-evaporated metallurgy process for depositing a wide variety of metallurgy with low temperature lift-off structures.