Browse Prior Art Database

Thermally Conductive Elastomeric Cap for a Module

IP.com Disclosure Number: IPCOM000053852D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Neumann, EW [+details]

Abstract

In the manufacture of modules comprised of semiconductor chips mounted on insulating substrates, it is usually necessary to hermetically seal the chips and any top surface metallization. An improved cap 10 for such sealing is shown in Fig. 1 in position to be applied ever a substrate 12 with a semiconductor chip 14 mounted thereon, and in Fig,.2 the cap 10 is in place on the substrate 12. The cap 10 is formed of an elastomeric material, such as a silicone elastomer. To provide improved heat transfer characteristics, the elastomer can be filled with heat conducting particulates, such as alumina.