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Substrate Module Pin Assembly Technique

IP.com Disclosure Number: IPCOM000053856D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Ward, WC [+details]

Abstract

It is difficult to resistance braze materials having low electrical resistance due to very high current requirements to generate enough heat. The present technique allows the facile brazing of low resistance materials, which is illustrated (Fig. 2) in an embodiment in which a pin 10 is brazed to a via 12 on a substrate 14.