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Process Improvement for Fine Line Metallized Ceramics

IP.com Disclosure Number: IPCOM000053865D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Franchak, NP Nair, KK Rasile, J Smey, SL Truman, JA [+details]

Abstract

The fine-line metallized ceramic (MC) substrates presently developed and manufactured use the standard finish ceramic and the conventional photoetch processes used for MC products. However, in the case of extremely narrow lines and spacings, the conventional processes are not adequate to produce substrates that meet the electrical criteria with satisfactory yields. The most common defects found are opens, shorts, and voids in the lines after the etch processes. The major reason for these defects has been found to be the high degree of roughness and the high density of pits that are usually found on the surface of the ceramic.