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Stripper for Photosensitive Dielectric

IP.com Disclosure Number: IPCOM000053867D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Skarvinko, ER [+details]

Abstract

A photosensitive dielectric composition for use in the fabrication of printed circuit boards is shown in U.S. Patent 4,237,216. Occasionally, during the fabrication of printed circuit boards utilizing this composition, the pattern which is exposed on the board is not properly registered. This misregistration is generally only discovered after the photosensitive dielectric has been exposed and developed. The exposed photosensitive material is crosslinked and polymerized, and it is therefore very difficult to remove.