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Flexible, Self Aligning Heat Transfer Element Disclosure Number: IPCOM000053889D
Original Publication Date: 1981-Nov-01
Included in the Prior Art Database: 2005-Feb-12

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Nenadic, A [+details]


As the integrated circuit semiconductor devices become smaller and circuitry becomes more dense, the need for better techniques for removing heat from the devices generated during operation becomes more urgent. This element for conducting heat from a solder-bonded semiconductor device reduces the overall thermal resistance by obtaining an improved contact with the backside of the device and the cooling element. In addition, the element is relatively inexpensive and exerts a small force against the semiconductor device.