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The present structure provides the means to test the wire bond strength of microcircuits.
English (United States)
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Microcircuit Wire Bond Tensile Strength Tester
The present structure provides the means to test the wire bond strength of
The frame 10 supports conventional means 11 for moving platform 12 up and
down. A precision gauge 13, having a load range of from 0 to 10 grams, is fixed
to the platform. The microcircuit 15, having the bonds to be tested, is mounted
on an X-Y glide stage. A rod member 16, having a curved end or hook end 17 is
suspended from the weighing post 18 of the gauge.
In operation, stage 12 is lowered until the hook end 17 of the suspended rod
16 may be hooked under the microcircuit wire to be tested. The gauge platform is
then slowly raised, increasing the tension to the wire until breakage occurs. The
breakage point on the gauge is recorded, and the X-Y stage 14 is moved so as to
position the next wire in the microcircuit to be tested underneath the curved end
17 of rod 16. The stage 12 is again lowered to engage hooked end 17 with the
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