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Microcircuit Wire Bond Tensile Strength Tester

IP.com Disclosure Number: IPCOM000053923D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Tucker, CE [+details]

Abstract

The present structure provides the means to test the wire bond strength of microcircuits.