Bulk Acoustic Wave Solder Bond and Pin Integrity Tester
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12
It has been determined that the detection and location of faulty solder bonds and the detection of a lack of pin/header interface integrity can be achieved through the use of bulk acoustic waves. This test arrangement takes advantage of the fact that physical entities possessing mass and extent can each be described by a unique acoustical signature or profile produced by the propagation of bulk acoustic wave energy within and through the entity. Use of this testing basis allows automated real-time testing of metallized ceramic (MC) modules, for example, against meaningful criteria for pass/fail disposition.