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Mounting Substrate for Bubble Memory Chip

IP.com Disclosure Number: IPCOM000053989D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Snyder, KA [+details]

Abstract

An inner region R of upper surface S (Fig. 1) of ceramic substrate 10 is provided with three parallel rows of identically incline planes 11-13. The identical inclination angles a of the planes 11-13 (Fig. 2) are judiciously selected such that the bubble memory chips 14 are tilted when mounted thereto with respect to the direction D of the magnetic bias field. As a result, a holding field is provided for chips 14.