Browse Prior Art Database

Module to Card Interconnection

IP.com Disclosure Number: IPCOM000054000D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Fredriks, RM Goldmann, LS [+details]

Abstract

Handling and differences in thermal expansion coefficients of modules and cards have caused failures in pins and pin braze areas on modules. The interconnection described here substantially reduces these problems.