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Module to Card Interconnection Disclosure Number: IPCOM000054000D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

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Fredriks, RM Goldmann, LS [+details]


Handling and differences in thermal expansion coefficients of modules and cards have caused failures in pins and pin braze areas on modules. The interconnection described here substantially reduces these problems.