Improved Process for Gold Metallization
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12
A gold (Au) metallurgy process has been previously considered for integrated circuit fabrication to obtain increased electromigration performance as well as a diffusion barrier to keep Au out of Si. A TiN or Au-transition-metal phase (sputtered films) was proposed to separate Au from Pb-Sn during reflow of solder mounds.