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Improved Process for Gold Metallization Disclosure Number: IPCOM000054004D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

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Howard, JK White, JF [+details]


A gold (Au) metallurgy process has been previously considered for integrated circuit fabrication to obtain increased electromigration performance as well as a diffusion barrier to keep Au out of Si. A TiN or Au-transition-metal phase (sputtered films) was proposed to separate Au from Pb-Sn during reflow of solder mounds.