Browse Prior Art Database

Improved Process for Gold Metallization

IP.com Disclosure Number: IPCOM000054004D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Howard, JK White, JF [+details]

Abstract

A gold (Au) metallurgy process has been previously considered for integrated circuit fabrication to obtain increased electromigration performance as well as a diffusion barrier to keep Au out of Si. A TiN or Au-transition-metal phase (sputtered films) was proposed to separate Au from Pb-Sn during reflow of solder mounds.