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Partitioned Bubble Memory on Card Disclosure Number: IPCOM000054013D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue


Related People

Jadus, DK Seeger, RO [+details]


Bubble memories, in one form, are packaged to include a plurality of bubble memory modules on a card. Each module includes a chip for storing information;, inductors for providing rotating x and y magnetic fields, driver circuitry, and other elements, as required, to make each module functionally complete. The elements in each module are supported by a substrate which is limited in dissipating the power from the module. If all the circuitry contained in a module were used at the same time, the power dissipation would require the substrate to be enlarged or other means would be required to dissipate the heat. Unless the heat is properly dissipated from the module, various components would be damaged.