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T-Shaped Chip Pad Arrangement

IP.com Disclosure Number: IPCOM000054021D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Klein, W Klink, E Najmann, K Rudolph, V [+details]

Abstract

For connecting several chips arranged on a substrate by only one wiring plane, the chip pads are arranged in the form of a T. Control signals which also have to be applied to adjacent chips are fed to the chip pads in part A of the T-shaped pad arrangement. Signals which do not have to be applied to all chips are connected to part B of the pad arrangement.