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Method for Writing Metal Patterns onto an Insulating Substrate

IP.com Disclosure Number: IPCOM000054087D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Bogardus, EH Horstmann, RE [+details]

Abstract

A method for the placement of controlled patterns of conducting lines on an insulating substrate is described. Wire is directed onto the substrate which is heated while a potential is applied between the substrate and the wire. The potential causes bonding of the wire to the substrate.