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Mini Structure Joining Technique Disclosure Number: IPCOM000054096D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-13

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Hoekstra, JP [+details]


The concept of using solder to make a vertical joint in micro-electronic structures is described herein. It can be used to provide a ready exchange of modules mounted orthogonally to a circuit board. These modules contain circuits and interconnections, while the circuit board also contains interconnections. At the edge of the module interconnections which are to be joined to the board interconnections, a low temperature solder is placed by a vapor deposition and masking technique. When properly positioned, the solder elements on the module abut those on the circuit board and can be melted by focused local heating. Another approach uses a low temperature solder wire which lies along the orthogonally contacted module and circuit board.