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Anisotropically etched silicon may be used as an alignment jig for simultaneous precise positioning of many hybrid chips (such as LEDs) on a common substrate.
English (United States)
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Jig for Simultaneous Assembly of Hybrid Chips on a Substrate
Anisotropically etched silicon may be used as an alignment jig for
simultaneous precise positioning of many hybrid chips (such as LEDs) on a
The figure shows a cross-section of a silicon wafer jig 10, etched to receive
chips 12 on one side thereof and a vacuum on the other side, so as to attain a
vacuum hold-down of the chips.
To attain essentially perfect chip attachment, two such jigs may be used, in
the following sequence of operations. Chips are first dropped into V-grooved
rectangular holes 14 having flat bottoms 16 which are coated with a metal 18 to
form an electrical contact stripe to the back side of the chips. Then, a vacuum is
applied from the back through holes 20 to hold the chips in place during test,
which is done on the top face by probing. At this time, chips are also tested for
uniform thickness by sensing from the top. Any chips not passing the tests, e.g.,
electrical and/or optical characteristics and/or thickness, may be "sucked up" by
a vacuum probe and replaced by others which meet specifications.
Next, a second jig 22 of precisely the same nature is brought down over the
chips, and a vacuum is applied on the second jig 22. Vacuum is then released on
the first jig 10, thus transferring the chips to the second jig 22, again in precisely
determined locations. The bottoms of the chips are now exposed, and may be
treated with adhesive, if necessary, to make a bond. I...