Browse Prior Art Database

Heat Transfer Apparatus

IP.com Disclosure Number: IPCOM000054186D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Andros, FE Lee, SW Shay, RJE [+details]

Abstract

This arrangement provides more efficient heat transfer from a circuit chip to an enclosing module cover or cap.