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Composite Sandwich for Thermoelastic Compatibility

IP.com Disclosure Number: IPCOM000054187D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Engel, PA Pedroza, GC Shay, RJE [+details]

Abstract

As shown in the drawing, an improved cap for a circuit module is provided by having an outer shell 3 of aluminum and an inner layer 5 of tungsten suitably bonded to the inside of the aluminum shell 3. The circuit chip 7 is electrically and thermally mounted to the tungsten layer 5, and since the tungsten has a coefficient of thermal expansion which approximates that of the silicon in chip 7, the thermal strains, otherwise produced, are reduced or eliminated. Suitable mechanical standoff and pin connections are provided, as shown at 9 and 11, extending through the base element 13.