Precise Overlay of Blind Written E-Beam Patterns on Packaging Substrates
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-13
A scanning electron beam lithographic tool will be used to manufacture the top surface metallurgy layers of future packaging substrates. Doing so will necessitate distortion of the E-beam deflection at each product site to produce the overlay required with previously processed levels on distorted packaging substrates. The usual solution to this problem involves the use of registration marks positioned in rectangular configurations about the areas to be exposed. Detection of these marks provides the position information needed to linearly distort the E-beam deflection to overlay the preceding level.