Browse Prior Art Database

Solid-State Enhanced Cooling Package

IP.com Disclosure Number: IPCOM000054261D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Simons, RE [+details]

Abstract

This improved cooling package uses solid-state thermo-electric modules in combination with a heat pipe to reduce incoming cooling air temperatures below ambient and thereby augment the transfer of heat from the conduction cooled modules.