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High Performance Leak Proof Cold Plate

IP.com Disclosure Number: IPCOM000054265D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Antonetti, VW Moran, KP Pascuzzo, AL Schmidt, RR [+details]

Abstract

An integrated circuit chip module cold plate 10 is provided which is capable of meeting the thermal geometric constraints, and yet is virtually leak proof.