Browse Prior Art Database

Thermal Module Disclosure Number: IPCOM000054266D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue


Related People

Hwang, UP Simons, RE [+details]


The thermal performance of an integrated circuit chip module 10 is improved by lowering the resistance of the thermal interfaces 12a and 12b therein and diminishing impact shock problems. The integrated circuit chip module 10 contains spring loaded pistons 14 which are mounted in cylindrical openings 16 in the module cap 18 and are biased against the chip 20 by the spring means 22. The interface 12a between each chip 20 and piston 14 tends to have a high thermal resistance because of air spaces therein. For example, if a chip 20 is slightly tilted, the associated piston 14 only contacts it at a point or along a small area. It has also been found, that any impact on the module 10, such as might be cause by dropping or vibrating it, the piston 14 leaves the chip 20, hits and rebounds from the spring 22, and impacts the chip.