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Circuit Repair/Work Of Metallized Polymide Substrated Disclosure Number: IPCOM000054375D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

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Related People

Bakos, P Darrow, RE Myers, FR [+details]


The present method has the unique ability in that it can be used to repair circuitry at the substrate level and also can be used to make necessary engineering changes for single and multi-chip modules.