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Multilayer Circuitry Using Welded Metalized, Polymide Film

IP.com Disclosure Number: IPCOM000054376D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Funari, J Modlo, RJ [+details]

Abstract

It is well known that circuitry )0 can be applied to a polyimide film 11.