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Chip Bonding Adapter

IP.com Disclosure Number: IPCOM000054378D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Abstract

There are two widely used techniques for making interconnections to integrated circuit chips. The first involves connecting physical wires between points on the chip and external pads. The second technique utilizes small solder balls end is generally termed "ball limiting metallurgy" (BLM).