Browse Prior Art Database

Low Resistance Conductive Paste

IP.com Disclosure Number: IPCOM000054400D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Kelly, JE [+details]

Abstract

Presently employed conductive pastes, used on MLC (multilayer ceramic substrates to short out surface pad terminals during gold plating of EC pads, have a high and variable resistance.