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Lift-Off Underlay With Improved Crack Resistance And Thermal Stability

IP.com Disclosure Number: IPCOM000054401D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Havas, J Paal, G [+details]

Abstract

The stabilization of the glass barrier lift-off underlay components of a stencil structure is performed at elevated temperatures (210-230 degrees C).