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The stabilization of the glass barrier lift-off underlay components of a stencil structure is performed at elevated temperatures (210-230 degrees C).
English (United States)
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Lift-Off Underlay With Improved Crack Resistance And Thermal Stability
The stabilization of the glass barrier lift-off underlay components of a stencil
structure is performed at elevated temperatures (210-230 degrees C).
The stabilization reduces the susceptibility of the imaging resist to stress-
induced cracking and renders the structure resistant to high metal evaporation
temperatures. The heat stabilization is made difficult by a contrary requirements
the cured material must remain sufficiently soluble in the lift-off solvent.
It has been found that curing the resist underlay in a 95:5 mixture by volume
of nitrogen and oxygen will result in providing the proper combination of thermal
stability and solubility.
The structure cured in a nitrogen/oxygen ambient atmosphere exhibits a
marked improvement with respect to cracking susceptibility, thermal stability and
contamination control without change of the solubility in the lift-off solvent.