Browse Prior Art Database

RF Sputter Etch Heating

IP.com Disclosure Number: IPCOM000054402D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Curry, WJ Dahlke, GP Galyon, GT Martin, HJ [+details]

Abstract

Deposition of thin films on Si substrates requires a thermal preheat to improve film adhesion. This is routinely accomplished through the use of quartz lamps or resistance heaters, utilizing temperature controllers. The thermal preheat process is dependent on time, and the final temperature is dependent on the starting temperature.