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Method To Reduce Flaking And Facilitate Cleaning Of Plasma Deposition Systems Disclosure Number: IPCOM000054403D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

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Martinet, F [+details]


There has been experienced flaking from the cathode, anode and chamber walls of plasma deposition systems for the deposition of silicon dioxide, silicon nitride, polycrystalline silicon, or the like. The flaking causes particulate inclusions in the plasma-deposited films which have adverse effects on the yield and reliability of these films.