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In Situ RIE/Ion Milling Process And Tool Configuration

IP.com Disclosure Number: IPCOM000054404D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Hassan, JK Oldakowski, CC [+details]

Abstract

Existing reactive ion etching processes have undesirable reaction by-products. These by-products are on or up to 75 monolayers deep into the wafer. The by-products result in undesirable material growths and constitute corrosion sources. A means for the safe removal of these undesirable reaction by-products is described herein.