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Excess solder can be removed from a semiconductor substrate or other workpiece by this process without mechanical contact to the solder surface or the use of flux.
English (United States)
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Centrifugal Solder Dress Process
Excess solder can be removed from a semiconductor substrate or other
workpiece by this process without mechanical contact to the solder surface or the
use of flux.
In various electronic applications, it is frequently desirable to salvage
semiconductor packages by reworking, i.e., removing the cap, and repairing or
replacing defective components within the module. When soldered elements are
removed and replaced, the excess solder must first be removed from the
soldered pads. Removal of this solder is painstaking, costly, and can result in
damage to the substrate.
In this process excess solder is removed by placing the substrate on a
rotatable table, heating, and spinning the molten solder off the substrate, leaving
a clean smooth surface. The substrate is heated to approximately 200 degrees
C, and the rotatable table rotated at 2,000 to 4,000 rpm for 5 to 10 seconds. The
centrifugal force generated by this spinning causes the molten solder to fly off
from the various elements of substrate, leaving a clean, smooth surface. This
leaves the surface in condition for re-soldering.
The spinner for rotating the device can be designed so that a vacuum chuck
holds the substrate in place, and also a heating element is provided to supply the
heat necessary to melt the solder.