Browse Prior Art Database

Solder Joint Stretcher

IP.com Disclosure Number: IPCOM000054407D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Caccoma, GA Locke, CH Meinert, RG Musits, B [+details]

Abstract

The figure shows an arrangement for "stretching" solder joints. In operation, vacuum funnel 1, mounted on slide 3, is lowered onto chip 14. Slide 3 is then clamped to slide 5 via clamp 7. Slide 5 is thereafter lifted up to close the preset gap 9 between the slide and micrometer 11. Substrate 13, with chip 14 mounted thereon, is preheated to 230 degrees C via a bias heater (not shown). A laser beam (not shown) of sufficient power is then passed through calcium fluoride window 15 onto the chip. While the laser beam impinges upon the chip, a vacuum is applied to the vacuum funnel, and the chip is lifted up the preset distance. The laser beam is then turned off, and the solder joint solidifies in the stretched position.