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Dual Seal Band Metallurgy On MLC Substrates

IP.com Disclosure Number: IPCOM000054412D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Haddad, MM Roth, GW [+details]

Abstract

Methods are disclosed for providing a dual layer of nickel on multilayer ceramic (MLC) hermetic seal bands. The dual layer comprises a layer of electroplated nickel and a layer of electroless nickel. This dual layer improves the seal band metallurgy by providing a void-free, non-porous nickel matrix suitable for hermetic cap sealing.