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Controlled Environment Oven With Visible Access

IP.com Disclosure Number: IPCOM000054413D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Locke, CH Musits, B Wustrau, FE [+details]

Abstract

An oven box was designed for chip rework on multiple chip modules. The design incorporates an oven box top plate made up of three layers of quartz plate with an air gap between the plates. The gap in the bottom has bare nichrome wire in a grid form to make up a heating element for the top plate. The gap in the top is used to cool the top plate. The transparent heated top plate is used to cover the oven for chip rework and allows observation of a substrate.