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Impact-Absorbing Cooling Piston For Thermal Conduction Disclosure Number: IPCOM000054421D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

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Moeller, TL [+details]


A technique for conducting heat away from an integrated circuit chip joined to a substrate by solder bonding is to place a metal piston in contact with the outer surface of the chip and a suitable cold plate. This basic concept is disclosed in detail in U.S. Patent 3,993,123. This structure is a modification of the basic concept. This structure reduces the shock load to the semiconductor in the event of a severe shock to the semiconductor package.