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Stress Avoidance In Cofired Two Material Ceramics

IP.com Disclosure Number: IPCOM000054515D
Original Publication Date: 1980-Feb-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Brownlow, JM [+details]

Abstract

Incorporation of high capacitance ceramic materials in multilayer ceramic-metal substrates requires an accommodation to large thermal expansion differences between the structural ceramic layers, glass-ceramic and the titanate high capacitance ceramics. High stress and cracking would occur if these layers were allowed to sinter together.