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Pressure Sensitive Hot Melt Wafer Mounting Tape

IP.com Disclosure Number: IPCOM000054588D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Escott, BM [+details]

Abstract

In semiconductor dicing operations a wafer is secured into a pressure-sensitive mounting tape. While secured to the tape, the wafer is diced without cutting through the tape so that the individual chips will remain adhering to the tape.