Plasma Generated Telflon Module Encapsulation
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13
TELFLON* is a moisture and gas barrier which is impervious to water and to chemical reaction with gases. It may be plasma-polymerized to thin, pinhole-free coatings. This technique may be used to encapsulate circuit modules with long lasting, impervious, resilient barrier coatings.