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Plasma Generated Telflon Module Encapsulation

IP.com Disclosure Number: IPCOM000054602D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Sacher, E Susko, JR [+details]

Abstract

TELFLON* is a moisture and gas barrier which is impervious to water and to chemical reaction with gases. It may be plasma-polymerized to thin, pinhole-free coatings. This technique may be used to encapsulate circuit modules with long lasting, impervious, resilient barrier coatings.