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This process relates to the non-chemical removal of photoresist during the fabrication of printed circuit modules whereby the use of organic solvents is eliminated.
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Removal of Photoresist
This process relates to the non-chemical removal of photoresist during the
fabrication of printed circuit modules whereby the use of organic solvents is
When personalizing the module substrates and after the step of selectively
chrome etching, a first pass is made wherein the substrates still in titanium racks
are coated with a rosin-based flux. Then, the substrates are placed in a nitrogen
belt-driven (1 ft/min.) tunnel oven and heated at 200 degrees C for at least 2
minutes and then raised to 360-400 degrees C for 30 seconds. After exiting
from the oven, the substrates go through a cleaning operation by spraying or
ultrasonic application of perchloroethylene.
After pinning and tinning the substrates, a second pass is made wherein the
substrates are first immersed in a rosin-based flux and then immersed in a 330
degrees C solder bath (10% Sn, 90% Pb) for approximately 10 seconds.
Following this, the substrates are quenched in a solution of 75%
perchloroethylene and 25% rosin flux. The substrates then go through a final
perchloroethylene cleaning and are ready for stock.