Browse Prior Art Database

Chip Attachment Lead Formation

IP.com Disclosure Number: IPCOM000054604D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Pittwood, DG [+details]

Abstract

This method directly forms integrated circuit (IC) chip attachment leads on an epoxy-glass laminated printed circuit (PC) board or substrate. The PC board, during its fabrication, is formed with cavities C1 which are associated with the formation of the chip attachment leads.