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Chip Attachment Lead Formation Disclosure Number: IPCOM000054604D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

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Pittwood, DG [+details]


This method directly forms integrated circuit (IC) chip attachment leads on an epoxy-glass laminated printed circuit (PC) board or substrate. The PC board, during its fabrication, is formed with cavities C1 which are associated with the formation of the chip attachment leads.