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Ceramic Shorted and Open Chips for Reliability Tests of MC and MCP Substrates Disclosure Number: IPCOM000054609D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

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Memis, I Rasile, J Stephans, E [+details]


The present method provides ceramic test chips to be used for testing of metallized circuitry on substrates and is an alternative which presents some advantages over the use of silicon wafers.