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Ceramic Shorted and Open Chips for Reliability Tests of MC and MCP Substrates

IP.com Disclosure Number: IPCOM000054609D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Memis, I Rasile, J Stephans, E [+details]

Abstract

The present method provides ceramic test chips to be used for testing of metallized circuitry on substrates and is an alternative which presents some advantages over the use of silicon wafers.