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Locking Mechanism for Pistons Disclosure Number: IPCOM000054621D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

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Dobrowolski, R Durand, RD [+details]


Removal of heat from modules containing high power semiconductor chips can be accomplished in a variety of ways. One technique, shown in Fig 1A, uses conduction through a solid body 10, such as a metal piston, to provide a low resistance path between an IC chip 12 and the package containing them. A spring-loading mechanism 14 insures close contact between the piston and the chip, thereby minimizing interface resistance.