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Sputtered Metal Lift Off Process

IP.com Disclosure Number: IPCOM000054625D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Curry, WJ Galyon, GT Giddings, JJ Lee, AP [+details]

Abstract

Previous attempts to sputter metal into the lift-off photoresist structure presently used to define the land (stripe) metallurgy were not successful because the sputtered metal coated the "sidewalls" of the photoresist structure. This inhibited the ability of the photoresist structure to lift-off and leave behind a sharp, clearly defined metal land structure.